Account Manager Electromechanics
Phone: +358 50 486 77 17
Phone: +46 (0)8 759 35 23
EG Electronics product offering of board level shieldning is focus on the photoetching process, which allows the fabrication of parts with complex shapes and features that are impossible to duplicate by other methods without expensive tooling. Board level shielding is typically etched from .007″ – .020″ brass, nickel silver, copper or cold rolled steel. Board level shielding can also be manufactured out of beryllium copper, if spring qualities are desired. The standard finish is tin plate.